Products
DISPARLON 6250
- Form
- Powder
- Function
- Rheology Control
- Main Composition
- Amide
- Features
- Lower activation temperature is required compared to DISPARLON 6500, resulting in outstanding performance in “cold-processed” MS/STP/SMP sealants and adhesives.
Particularly effective in one-component MS/STP/SMP sealants and adhesive.
Prevents slumping and settling with increased viscosity. - Application
- Sealant and Adhesive
- Active content
- 100%
- Solvent
- None
- Recommended addition level
- 0.5-5.0% on the total formulation
Amide-wax Recommended activation temperature for MS/SMP/STP adhesive and sealant use
You may wish to explore...
CONTACT
CONTACT
For any inquiries about our products or other questions, please use this form to contact us.