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DISPARLON TFS-20

Form
Powder
Function
Rheology Control
Main Composition
Amide
Features
Lower activation temperature is required compared to conventional amide-wax, resulting in outstanding performance in “cold-processed” MS/STP/SMP sealants and adhesives.
Excellent activation efficiency, thickening, anti-slumping and storage stability and early-grab properties for high-tack systems.
Application
Sealant and Adhesive
Active content
100%
Solvent
None
Recommended addition level
0.5-5.0% on the total formulation
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CONTACT

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