Products
DISPARLON TFS-20
- Form
- Powder
- Function
- Rheology Control
- Main Composition
- Amide
- Features
- Lower activation temperature is required compared to conventional amide-wax, resulting in outstanding performance in “cold-processed” MS/STP/SMP sealants and adhesives.
Excellent activation efficiency, thickening, anti-slumping and storage stability and early-grab properties for high-tack systems. - Application
- Sealant and Adhesive
- Active content
- 100%
- Solvent
- None
- Recommended addition level
- 0.5-5.0% on the total formulation
CONTACT
CONTACT
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